Spark Plasma Sintering of Ultrafine YSZ Reinforced Cu Matrix Functionally Graded Composite

doi:10.1007/s40195-016-0512-0

Abstract

Abstract:

Copper matrix composites have received more attentions as possible candidate for thermal and electrical conductive materials to be used in electrical contact applications. In this study, five-layered Cu/YSZ (yttria-stabilized zirconia) functionally graded material (FGM) and copper matrix composite specimens containing 3 and 5 vol% YSZ particles plus pure Cu specimen were synthesized using powder metallurgy (PM) route and spark plasma sintering (SPS) consolidation process. The microstructural and some physical, mechanical features of all specimens were characterized. Microscopic examinations showed that ultrafine YSZ particles were distributed in the copper matrix almost homogeneously. An appropriate interface was observed at each layer of FGM. The density measurement indicated that the graded structure of the composite could be well densified after the SPS process. The microhardness values of various layers of Cu/YSZ FGM specimen were gradually altered from 56.3 (pure copper side) to 75.2 HV (Cu-5 vol% YSZ side). The increase of YSZ content resulted in a decrease in electrical conductivity. Additionally, thermal conductivity of Cu/YSZ FGM specimen [308.0 W/(m K)] was determined to be higher than that of the Cu-5 vol% YSZ composite specimen [260.7 W/(m K)]. Accordingly, it can be concluded that the Cu/YSZ FGM can be a good candidate for the electrical applications, like sliding electrical contacts, where different material characteristics in the same component are required.

Key words: Functionally graded material (FGM), Spark plasma sintering (SPS), Composite, Microstructure, Interface

Jafar Mirazimi,Parvin Abachi,Kazem Purazrang. Spark Plasma Sintering of Ultrafine YSZ Reinforced Cu Matrix Functionally Graded Composite[J]. Acta Metallurgica Sinica (English Letters), 2016, 29(12): 1169-1176.

Figures/Tables 9

Fig. 1 a Schematic of Cu/YSZ FGM specimen, b macrograph of Cu/YSZ FGM green compact, which prepressed using steel die

Fig. 2 Illustration of temperature and pressure profiles during the SPS process of the Cu/YSZ FGM specimen. The sintering temperature, pressure and time are 720 °C, 40 MPa and 5 min, respectively

Fig. 3 Micrograph of Cu/YSZ FGM specimen after consolidation by SPS machine. Height and diameter are about 5 (each layer almost 1 mm) and 30 mm, respectively

Fig. 4 FE-SEM micrographs of a as-received Cu, b YSZ powder particles

Fig. 5 Optical micrographs of a pure Cu (0 vol% YSZ), b Cu-3 vol% YSZ, c Cu-5 vol% YSZ composite specimens

Fig. 6 FE-SEM micrographs of Cu/YSZ FGM (central image): a interface of pure Cu/Cu-2 vol% YSZ, b interface of Cu-4 vol% YSZ and Cu-5 vol% YSZ layers, c individual pure Cu, Cu-3 vol% YSZ, Cu-5 vol% YSZ graded layers

Table 1 EDS analysis results on different layers of Cu/YSZ FGM specimen

FGM layer	Elements (wt%)
FGM layer	Cu	Zr	Y	O
Pure Cu (EDS1)	100.00	0.00	0.00	0.00
Cu-2 vol% YSZ (EDS2)	96.5	1.40	0.69	1.37
Cu-3 vol% YSZ (EDS3)	94.70	4.16	0.41	0.73
Cu-4 vol% YSZ (EDS4)	91.11	6.21	0.70	1.98
Cu-5 vol% YSZ (EDS5)	89.57	6.61	0.81	3.01

Table 2 Relative density, Vickers microhardness, specific electrical resistivity, electrical and thermal conductivity values of pure Cu, Cu-YSZ composite and Cu/YSZ FGM specimens

Material	Relative density (%)	Microhardness (HV)	Specific electrical resistivity (μΩ cm)	Electrical conductivity (IACS %)	Thermal conductivity (W/(m K))
Pure Cu	99.33	48.6	1.84	93.70	397
Cu-3 vol% YSZ	96.73	80.7	2.45	70.37	298
Cu-5 vol% YSZ	95.4	87	2.80	61.57	260.7
Cu/YSZ FGM	97.3	56.3-75.2	2.37	72.74	308

Fig. 7 Vickers microhardness of various layers in Cu/YSZ FGM specimen produced by SPS process

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