Effects of Zn, Zn-Al and Zn-P Additions on the Tensile Properties of Sn-Bi Solder

doi:10.1007/s40195-014-0165-9

Abstract

Abstract:

Effects of Zn, Zn-Al and Zn-P additions on melting points, microstructures, tensile properties, and oxidation behaviors of Sn-40Bi lead-free solder were investigated. The experimental results show that the addition of these three types of elements can refine the microstructures and improve the ultimate tensile strength (UTS) of solder alloys. The fractographic analysis illustrates that ductile fracture is the dominant failure mode in tensile tests of Sn-40Bi-2Zn (SBZ) and Sn-40Bi-2Zn-0.005Al (SBZA) specimens, while brittle fracture is the controlled manner in Sn-40Bi-2Zn-0.005P (SBZP) and Sn-58Bi solders. XPS analysis indicates that trace amounts of both Al and P additives in solder can improve the antioxidant capacity, whereas only the additive of Al in solder can reduce the thickness of oxidation film.

Key words: Sn-Bi, Tensile, test, Microstructure

Wang Xiaojing, Wang Yanlai, Wang Fengjiang, Liu Ning, Wang Jianxin. Effects of Zn, Zn-Al and Zn-P Additions on the Tensile Properties of Sn-Bi Solder[J]. Acta Metallurgica Sinica (English Letters), 2014, 27(6): 1159-1164.

Figures/Tables 7

Fig. 1 DSC curves of the solder alloys

Fig. 2 SEM micrographs of the lead-free solders: a Sn-58Bi; b Sn-40Bi; c Sn-40Bi-2Zn; d Sn-40Bi-2Zn-0.005Al; e Sn-40Bi-2Zn-0.005P

Fig. 3 Engineering stress-strain curves of Sn-Bi series of alloys

Table 1 Mechanical properties of the Sn-58Bi, Sn-40Bi, Sn-40Bi-2Zn, Sn-40Bi-2Zn-0.005Al, and Sn-40Bi-2Zn-0.005P alloys

Materials	Tensile strength (MPa)	Strain at UTS, ε _Eu	Elongation (%)
Sn-58Bi	57.3	0.017	0.12
Sn-40Bi	51	0.029	0.24
Sn-40Bi-2Zn	65	0.048	0.25
Sn-40Bi-2Zn-0.005Al	70	0.045	0.33
Sn-40Bi-2Zn-0.005P	68	0.036	0.15

Fig. 4 Fracture surfaces of the lead-free solders: a Sn-58Bi; b Sn-40Bi; c Sn-40Bi-2Zn; d Sn-40Bi-2Zn-0.005P; e Sn-40Bi-2Zn-0.005Al

Fig. 5 XPS surface analysis results of a Sn-Bi-Zn, b Sn-Bi-Zn-Al solders after exposure at 170 °C for 7 min

Fig. 6 XPS depth profiles for a oxygen b zinc, c the thickness of oxidation films for the SBZ, SBZA, and SBZP specimens after oxidation at 170 °C for 7 min

References 25

[1]	X.C. Tong,Advanced Materials for Thermal Management of Electronic Packaging, vol. 30(Springer-Verlag, New York, 2011), pp. 305-371
[2]	L. Zhang, Z. Yuan, Y. Zhu, B. Xu, H. Matsuura, F. Tsukihashi, Colloids Surf. A 44, 57 (2012)
[3]	G.F. Ma, H.L. Zhang, H.F. Zhang, H. Li, Z.Q. Hu,Mater. Lett. 62, 1853(2008)
[4]	Y.I. Dutchak, V.P. Osipenko, P.V. Panasyuk,Sov. Phys. J. 11, 145(1968)
[5]	J. Shen, C. Wu, S. Li, J. Mater.Sci. 23, 156(2012)
[6]	T.Y. Kang, Y.Y. Xiu, L. Hui, J.J. Wang, W.P. Tong, C.Z. Liu, J. Mater.Sci.Technol. 27, 741(2011)
[7]	M. McCormack, S. Jin, G.W. Kammlott,Appl. Phys. Lett. 64, 580(1994)
[8]	C.H. Raeder, L.E. Felton, V.A. Tanzi, D.B. Knorr, J. Electron.Mater. 23, 611(1994)
[9]	S. Chen, L. Zhang, J. Liu, Y. Gao, Q. Zhai,Mater. Trans. 51, 1720(2010)
[10]	Q. S. Zhu, H.Y. Song, in Proceedings of the 9th ICEPT-HDP, Beijing, 10-13 Aug. 2009, p. 1043
[11]	Y.M. Kim, T.J. Kim, M.Y. Choi, Y.H. Kim, J. Alloys Compd. 575, 350(2013)
[12]	I. Shohji, T. Nakamura, F. Mori, S. Fujiuchi,Mater. Trans. 43, 1797(2002)
[13]	F. Wang, F. Gao, Y. Qian, J. Electron.Mater. 35, 1818(2006)
[14]	T.H. Chuang, H.J. Lin, J. Electron.Mater. 38, 420(2009)
[15]	H.Z. Huang, X.Q. Wei, L. Zhou, X.D. Liu, G.L. Guo, Acta Metall. Sin. (Engl. Lett.) 19, 251(2006)
[16]	K.L. Lin, T.P. Liu,Oxid. Met. 50, 255(1998)
[17]	T.C. Chang, J.W. Wang, M.C. Wang, M.H. Hon, J. Alloys Compd. 422, 239(2006)
[18]	M.L. Huang, N. Kang, Q. Zhou, Y.Z. Huang, J. Mater.Sci.Technol. 28, 844(2012)
[19]	M. Kitajima, T. Shono,FUJITSU Sci. Technol. J. 2, 225(2005)
[20]	M. Hansen, Constitution of Binary Alloys, 2nd edn. (McGraw-Hill Book Co., New York, 1958)
[21]	K.L. Lin, L.H. Wen, T.P. Liu, J. Electron.Mater. 27, 97(1998)
[22]	J. Han, H. Chen, M. Li, Acta Metall. Sin. (Engl. Lett.) 25, 214(2012)
[23]	J.W. Martin, Precipitation Hardening, 2nd edn. (Butterworth-Heinemann, London, 1998)
[24]	A.A. El-Daly, A.M. El-Taher, Mater. Des. 47, 607(2013)
[25]	G. Li, Y. Shi, H. Hao, Z. Xia, Y. Lei, F. Guo, J. Alloys Compd. 491, 382(2010)