Finite Element Prediction of Residual Stress in Rhombic Dodecahedron Ti-6Al-4V Titanium Alloy Additively Manufactured by Electron Beam Melting

doi:10.1007/s40195-022-01446-y

Abstract

Abstract:

In this work, a three-dimensional nonlinear transient thermo-mechanically coupled finite element model (FEM) is established to investigate the variation in temperature and stress fields during electron beam melting (EBM) of rhombic dodecahedron Ti-6Al-4V alloy. The influence of the processing parameters on the temperature and residual stress evolutions was predicted and verified against existing literature data. The calculated results indicate that the interlayer cooling time has very little effect on both the temperature and stress evolutions, indicating that the interlayer cooling time can be set up as short as possible to reduce manufacturing time. It is presented that the residual stress of the intersection is higher than that of non-intersection. With increasing preheating temperature, the residual stress decreases continuously, which is about 20%-30% for every 50 °C rise in temperature. The temperature and stress fields repeated every four layers with the complex periodic scanning strategy. Both x and y-component residual stresses are tensile stresses, while z-component stress is weak compressive or tensile stress in typical paths. It is proposed that the interlayer cooling is necessary to obtain a rhombic dodecahedron with low residual stress. These results can bring insights into the understanding of the residual stress during EBM.

Key words: Electron beam melting, Ti-6Al-4V, Rhombic dodecahedron, Residual stress, Finite element analysis, Parametric study

Shangzhou Zhang, Yuankang Wang, Bing Zhou, Fanchao Meng, Hua Zhang, Shujun Li, Qingmiao Hu, Li Zhou. Finite Element Prediction of Residual Stress in Rhombic Dodecahedron Ti-6Al-4V Titanium Alloy Additively Manufactured by Electron Beam Melting[J]. Acta Metallurgica Sinica (English Letters), 2023, 36(1): 35-47.

Figures/Tables 17

Fig. 1 FE simulation demonstration for EBM printing rhombic dodecahedron. Red represents solid, and green represents powder

Fig. 2 Temperature dependent material properties of Ti-6Al-4 V: a Young’s modulus, b density, c yield stress, d thermal conductivity, e specific heat, f expansion coefficient

Fig. 3 Transient temperature vs. time at the middle of a non-intersection, interlayer cooling time of 0.1 s, b non-intersection, interlayer cooling time of 1 s, 3 s and 5 s, c intersection, interlayer cooling time of 0.1 s, d intersection, interlayer cooling time of 1 s, 3 s and 5 s

Fig. 4 Von Mises stress vs. time at the middle of a non-intersection, interlayer cooling time of 0.1 s, b non-intersection, interlayer cooling time of 1 s, 3 s and 5 s, c intersection, interlayer cooling time of 0.1 s, d intersection, interlayer cooling time of 1 s, 3 s and 5 s

Fig. 5 Transient temperatures for different preheating temperatures: a non-intersection, b intersection area

Fig. 6 Von Mises stress at different preheating temperatures: a non-intersection, b intersection area

Fig. 7 Scanning strategies in the actual EBM process

Fig. 8 Monitoring points on the first four layers under different scanning strategies

Fig. 9 Variation in the transient temperature with time considering interlayer cooling, at points a A1, b A2, c A3, d A4

Fig. 10 Von Mises stress histories considering interlayer cooling, at points a A1, b A2, c A3, d A4

Fig. 11 Temperature evolutions under different scanning strategies without interlayer cooling, at points a A1, b A2, c A3, d A4

Fig. 12 Variations in von Mises stress with time under different scanning strategies without interlayer cooling, at points a A1, b A2, c A3, d A4

Fig. 13 Different paths for EBM rhombus dodecahedron model

Fig. 14 Residual stress distributions considering layering cooling, along a path-1, b path-5, c path-9

Fig. 15 Strain evolutions when the model is cooled to the preheating temperature, along a path-1, b path-5, c path-9

Fig. 16 Residual stress distributions without considering layering cooling, along a path-1, b path-5, c path-9

Fig. 17 Stress fields distribution of the model of EBM: a with interlayer cooling, b without interlayer cooling

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