Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating

doi:10.1007/s40195-017-0536-0

Abstract

Abstract:

Ti-Cu-N films were deposited on 316L stainless steel substrates by magnetic field-enhanced arc ion plating. The effect of substrate pulse bias duty cycle on the chemical composition, microstructure, surface morphology, mechanical and tribological properties of the films was systemically investigated. The results showed that, with increasing the duty cycle, Cu content decreases from 3.3 to 0.58 at.%. XRD results showed that only TiN phase is observed for all the deposited films and the preferred orientation transformed from TiN(200) to TiN(111) plane with the increase in duty cycle. The surface roughness and deposition rate showed monotonous decrease with increasing the duty cycle. The residual stress and hardness firstly increase and then decrease afterwards with the increase in duty cycle, while the variation of critical load shows reverse trend. Except for the film with duty cycle of 10%, others perform the better wear resistance.

Key words: Magnetic field, Arc ion plating, Ti-Cu-N film, Residual stress, Hardness

Sheng-Sheng Zhao,Yan-Hui Zhao,Lv-Sha Cheng,Vladimir Viktorovich Denisov,Nikolay Nikolaevich Koval,Bao-Hai Yu,Hai-Juan Mei. Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating[J]. Acta Metallurgica Sinica (English Letters), 2017, 30(2): 176-184.

Figures/Tables 11

Fig. 1 Schematic view of the magnetic field-enhanced arc ion plating system used to deposit Ti-Cu-N films

Fig. 2 Chemical compositions (at.%) of Ti-Cu-N films plotted as a function of duty cycle

Fig. 3 X-ray photoelectron spectral details collected from the Ti-Cu-N film with duty cycle of 50%

Fig. 4 X-ray different patterns of the Ti-Cu-N films prepared under different bias duty cycle

Fig. 5 A cross-sectional TEM micrographs and electron diffraction patterns of the Ti-Cu-N films with duty cycle of 10%, 50% and 80%, and a high-resolution photograph of the Ti-Cu-N film with duty cycle of 50%

Fig. 6 SEM images of Ti-Cu-N films deposition with different duty cycles

Fig. 7 Surface roughness and deposition rate of Ti-Cu-N films as a function of bias duty cycle

Fig. 8 Residual stress and critical load of Ti-Cu-N films as a function of bias duty cycle

Fig. 9 Hardness, elastic modulus and H3/E*2 value of Ti-Cu-N films as a function of bias duty cycle

Fig. 10 Wear rate and Friction coefficient of Ti-Cu-N films as a function of bias duty cycle

Fig. 11 Wear scar morphologies of Ti-Cu-N film at different duty cycles

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