NUMERICAL SIMULATION OF THE TEMPERATURE FIELD IN A SOLDER BALL UNDER PULSED LASER AND ITS EFFECT ON THE VIBRATION OF THE SOLDER

Acta Metallurgica Sinica (English Letters) ›› 2000, Vol. 13 ›› Issue (1): 168-172.

• Research paper • Previous Articles Next Articles

NUMERICAL SIMULATION OF THE TEMPERATURE FIELD IN A SOLDER BALL UNDER PULSED LASER AND ITS EFFECT ON THE VIBRATION OF THE SOLDER

C. Q. Wang; M. Y. Li and L. Fang (National Key Laboratory of Advanced Welding Production Technology, H. I. T., Harbin 150001, China)

Received:2000-02-25 Revised:2000-02-25 Online:2000-02-25 Published:2009-10-10

Abstract

Abstract: The research presented here is focused on the vibration condition of a small volume solder solder ball,which is placed on the surface of a soldering pad and is exerted a pulse modulated continuous wave laser heat source. Finite element method is applied to analyzed the temperature field in the solder ball, and experi- ment is conducted to test the vibration. the results show that,that, the temperature field flucturates with the same frequency as that of the laser pulse, which in turn causes a forced vibration of the same frequency in the liquid solder ball.

Key words: pulse modulated continuous wave laser, finite element analysis, forced vibration

C. Q. Wang; M. Y. Li and L. Fang (National Key Laboratory of Advanced Welding Production Technology, H. I. T., Harbin 150001, China). NUMERICAL SIMULATION OF THE TEMPERATURE FIELD IN A SOLDER BALL UNDER PULSED LASER AND ITS EFFECT ON THE VIBRATION OF THE SOLDER[J]. Acta Metallurgica Sinica (English Letters), 2000, 13(1): 168-172.

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NUMERICAL SIMULATION OF THE TEMPERATURE FIELD IN A SOLDER BALL UNDER PULSED LASER AND ITS EFFECT ON THE VIBRATION OF THE SOLDER

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