Fig. 1 Schematic of the setup for the in situ synchrotron diffraction experiments

Fig. 2 Vickers Hardness and electrical conductivity curves of Cu-Ni-Si alloy subjected to isochronal aging for 1 h a, b, isothermal aging c, d at 723 K for various time

Fig. 3 Typical pattern of in situ synchrotron diffraction experiments of Cu-Ni-Si alloy aged at 723 K a, enlarged magnifications showing minor precipitate peaks b; variation of dislocation densities c, Ni2Si phase peak heights d; selected portions of EBSD maps of Cu-Ni-Si alloys aged at 723 K for 2 h: e CR sample and f RTR sample. The recrystallized and deformed grains are colored blue and red, respectively; high-angle grain boundaries are depicted by black lines; RD, ND and TD are the rolling, normal, and transverse directions, respectively

Fig. 4 Bright field TEM images of Cu-Ni-Si alloys aged at 723 K for 2 h: a RTR sample and b CR sample; c TEM image of cryorolled Cu-Ni-Si alloy with selected area electron diffraction showing Ni2Si phase and d HRTEM image showing Ni2Si precipitate lying on dislocations

Fig. 5 a-f TEM images of Cu-Ni-Si alloys aged at 723 K for 2 h: dark-field images, precipitate size distribution and typical HRTEM images subjected to room temperature rolling a, c, e, cryorolling b, d, f, respectively

Fig. 6 SEM images of Cu-Ni-Si alloy aged at 723 K for 24 h: a RTR sample, b CR sample