Effect of Ball Milling on the Defeat of Few-Layer Graphene and Properties of Copper Matrix Composites

doi:10.1007/s40195-014-0156-x

Abstract

Abstract:

Graphene-reinforced copper composites recently have attracted more attention, since they exhibited excellent mechanical properties and could be used widely in many fields. Few-layer graphene (FLG) and copper powder were mixed by ball milling to produce homogeneous composite powders. Then, FLG-reinforced copper composites (FLG/Cu) were fabricated by spark plasma sintering (SPS) using the composite powders with a FLG volume fraction of 2.4 vol%. The effects of the rotating speed and the time of ball milling were analyzed based on the microstructure evolution and properties of the FLG/Cu composites. Obvious strengthening effect of FLG was found for the composites, and the conductance of the composite reaches 70.4% of IACS. The yield strength of the composite produced by ball milling at a speed of 100 r/min for 4 h is 376 MPa, which is 2.5 times higher than that of copper and higher than that of copper composite enhanced by 5 vol% CNTs (360 MPa). The defects produced in FLG with the increase of rotating speed and time could reduce the mechanical and conductive properties of the composites.

Key words: Copper, Composites, Ball milling, Mechanical properties, Conductivity

Cui Ye, Wang Lidong, Li Bin, Cao Guojian, Fei Weidong. Effect of Ball Milling on the Defeat of Few-Layer Graphene and Properties of Copper Matrix Composites[J]. Acta Metallurgica Sinica (English Letters), 2014, 27(5): 937-943.

Figures/Tables 7

Fig. 1 SEM image a and Raman spectrum b of the filler

Fig. 2 XRD patterns of the FLG/Cu composite powders with different ball milling speeds and time

Fig. 3 Raman spectrum of composite powder of FLG/Cu-300-4 a and the ratios of ID/IG and I2D/IG for different samples b

Fig. 4 SEM images of different composite powders: a FLG/Cu-100-4; b FLG/Cu-200-4; c FLG/Cu-300-4; d FLG/Cu-300-8

Fig. 5 SEM images showing the structures and fracture surfaces of composites FLG/Cu-100-4 and FLG/Cu-300-4: a structure of FLG/Cu-100-4 (the inset is the OM image of the composite); b structure of FLG/Cu-300-4; c fractograph of FLG/Cu-100-4; d fractograph of FLG/Cu-300-4

Fig. 6 a Stress-strain curves of FLG/Cu composites (the inset showing the specimens after compressed); b Comparison of the yield strength and the maximum compressive stress of FLG/Cu composites

Table 1 The conductivities and densities of composites

Sample	Conductivity (% IACS)	Relative density (%)
FLG/Cu-100-4	70.4	94.7
FLG/Cu-200-4	62.8	93.3
FLG/Cu-300-4	61.4	91.7
FLG/Cu-300-8	58.1	91.1

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