Interfacial Oxides Evolution of High-Speed Steel Joints by Hot-Compression Bonding

doi:10.1007/s40195-022-01413-7

Abstract

Abstract:

The interfacial oxidation behavior of Cr4Mo4V high-speed steel (HSS) joints undergoing hot-compression bonding was investigated by using optical microscopy (OM), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). In the heating and holding processes, dispersed rod-like and granular $\delta - {\text{Al}}_{{2}} {\text{O}}_{{3}}$ oxides were formed at the interface and in the matrix near the interface due to the selective oxidation and internal oxidation of Al, while irregular Si–Al–O compounds and spheroidal SiO₂ particles were formed at the interface. After the post-holding treatment, SiO₂ oxides and Si–Al–O compounds were dissolved into the matrix, and $\delta - {\text{Al}}_{{2}} {\text{O}}_{{3}}$ oxides were transformed into nanoscale $\alpha - {\text{Al}}_{{2}} {\text{O}}_{{3}}$ particles, which did not deteriorate the mechanical properties of the joints. The formation and migration of newly-formed grain boundaries by plastic deformation and post-holding treatment were the main mechanism for interface healing. The tensile test results showed that the strength of the healed joints was comparable to that of the base material, and the in-situ tensile observations proved that the fracture was initiated at the grain boundary of the matrix rather than at the interface. The clarification of interfacial oxides and microstructure is essential for the application of hot-compression bonding of HSSs.

Key words: Hot-compression bonding, High-speed steel, Interfacial oxides, Interface healing, Mechanical properties

Wei-Feng Liu, Bi-Jun Xie, Ming-Yue Sun, Bin Xu, Yan-Fei Cao, Dian-Zhong Li. Interfacial Oxides Evolution of High-Speed Steel Joints by Hot-Compression Bonding[J]. Acta Metallurgica Sinica (English Letters), 2022, 35(11): 1837-1848.

Figures/Tables 15

Table 1 Chemical composition of commercial Cr4Mo4V steel (wt%)

C	Cr	Mo	V	Si	Al	Fe
0.82	4.20	4.24	1.01	0.21	0.016	Bal.

Fig. 1 a Microstructure of the as-received Cr4Mo4V HSS, b schematic of hot-compression bonding tests conducted using the thermal simulator machine, c dimensions of tensile test samples, d sampling scheme of tensile specimens from the bonding joint and base material, e dimensions of in-situ tensile test specimens, f sampling scheme of in-situ tensile specimens from the bonding joint, g schematic of the in-situ SEM setup for the tensile test

Fig. 2 Main procedures in the FIB lift-out technique for TEM sample preparation: a Pt is deposited at the interface area, b foil containing the interface area is cut free with the base material and lifted out of the sample, c foil is welded on a Cu grid, d foil is further thinned to electron transparency by ion milling

Fig. 3 a Micrograph of the bonding interface before hot-compression, b-d elemental distributions of O, Al, and Si, respectively

Fig. 4 a and b Oxides at the original bonding interface, and EDS maps of c O, d Al, e Si in the white rectangle

Fig. 5 TEM images of interfacial oxides: a Al2O3, b SiO2, and c compound oxide. EDS profiles of oxides: d Al2O3, e SiO2, f compound particles. FT: Fourier transformation

Fig. 6 Evolution of the interfacial microstructure under different holding time: a 0 min, b 10 min, c 1 h, d 6 h, e 12 h, f 24 h

Fig. 7 Evolution of interfacial oxides under different holding time: a 0 min, b 10 min, c 1 h, d 6 h, e 12 h, f 24 h

Fig. 8 a and b TEM images of interfacial oxides after 24 h of holding at 1150 ℃. EDS maps of c Al d O in image b

Fig. 9 Tensile strengths of the bonding joints and base material under different holding time

Fig. 10 Tensile fracture morphologies of the bonding joints and base material under various deformation and holding time. IS: intergranular surface, TS: transgranular surface

Fig. 11 In-situ tensile observations of the microstructural evolution of bonding joints with displacements of a 0 μm, b 186 μm, c 197 μm, d 245 μm

Table 2 Corresponding thermodynamic parameters of various chemical reactions at 298.15 K and 1423.15 K

Chemical reaction	$\Delta_{\text{r}} H_{\text{m}}^{{\theta }}$ ${\text{(kJ}} \cdot {\text{mol}}^{{ - {1}}} {)}$ (298.15 K)	$\Delta_{\text{r}} S_{\text{m}}^{{\theta }}$ ${\text{(J}} \cdot {\text{mol}}^{{ - {1}}} \cdot {\text{K}}^{{ - {1}}} {)}$ (298.15 K)	$\Delta_{\text{r}} H_{\text{m}}^{{\theta }}$ ${\text{(kJ}} \cdot {\text{mol}}^{{ - {1}}} )$ (1423.15 K)	$\Delta_{\text{r}} S_{\text{m}}^{{\theta }}$ ${\text{(J}} \cdot {\text{mol}}^{{ - {1}}} \cdot {\text{K}}^{{ - {1}}} {)}$ (1423.15 K)	$\Delta_{\text{r}} G_{\text{m}}^{{\theta }}$ ${\text{(kJ}} \cdot {\text{mol}}^{{ - {1}}} {)}$ (1423.15 K)
2Fe(s) + O₂(g) = 2FeO(s)	- 533,000	- 151.7	- 507,462	- 116.2	- 342,064
6FeO(s) + O₂(g) = 2Fe₃O₄(s)	- 637,800	- 236.3	- 693,036	- 313.1	- 247,532
4Fe₃O₄(s) + O₂(g) = 6Fe₂O₃(s)	- 471,600	- 266.3	- 449,190	- 235.1	- 114,552
4/3Cr(s) + O₂(g) = 2/3Cr₂O₃	- 759,800	- 182.7	- 738,837	- 153.6	- 520,279
Si(s) + O₂(g) = SiO₂(s)	- 903,500	- 177	- 909,012	- 184.7	- 646,213
4/3Al(s) + O₂(g) = 2/3Al₂O₃(s)	- 1,117,800	- 208.9	- 1,127,962	- 223.0	- 810,571

Fig. 12 Activity of O element in the Cr4Mo4V steel matrix versus the temperature

Fig. 13 Schematics of the healing mechanism of hot-compression bonding interface

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